PCB warpage simulations are important in helping to ensure high yield during production and durability during operations. As electronics packages becomes smaller and PCB’s becomes thicker, trace mapping technology is needed to accurately predict the warpage of the PCB.
This 1st part deals with the challenges of geometry cleanup on a realistic PCB assembly geometry.
This part covers the meshing and pre-processing for a PCB warpage simulation. It includes the all important trace mapping step, which allows simulations to capture the behavior of the PCB much more accurately. Historically this step is long and tedious. This video shows how far ANSYS has come in making these simulations painless.